Recommended
H. H. Tong, Y.-S. Lai, C. P. Wong,
Advanced flip chip packaging
, Springer
2013
A. Vardya, D. Lackey, L. Ritchey,
Flex and Rigid-Flex Fundamentals
, BR Publishing, Inc.
2017
Gupta, Tapan,
Handbook of thick- and thin-film hybrid microelectronics
, Hoboken : Wiley-Interscience
2003
W. J. Greig,
Integrated Circuit Packaging, Assembly and Interconnections
, Springer
2007
D. Lu, C. P. Wong,
Materials for Advanced Packaging
, Springer
2017
Happy Holden,
The HDI Handbook
, BR Publishing, Inc.
2009
Y. Li, D. Goyal,
3D Microelectronic Packaging: from fundamentals to applications
, Springer
2017
Podklady k přednáškám a cvičením budou studentům k dispozici v kurzu KET/TP v LMS Moodle.
